| 摘要 |
A light-receiving device 10 includes a plurality of light-receiving units 10A, 10B, and 10C, in which, in the element substrate 11A constituting the light-receiving unit 10A, the rear surface of a second terminal forming area 16Ac, upon which a connection pad PAc is formed, is bonded to the front surface of a cover glass 14B covering a plurality of light-receiving elements 12 constituting the light-receiving unit 10B, and in the element substrate 11C constituting the light-receiving unit 10C, the rear surface of a first terminal forming area 16Cb, upon which a connection pad PCb is formed, is bonded with the front surface of the cover glass 14B of the light-receiving unit 10B. As a result, an increase in manufacturing cost and a decrease in yield are mitigated so that it is possible to provide a light-receiving device upon which light-receiving elements are disposed continuously over a long distance at a high density, as well as an optical touch panel device provided with the same.
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