| 摘要 |
A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250 °C - 300 °C at a ramp rate of 50 °C/second - 100 °C/second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150 - 1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5. |
| 申请人 |
INTEL CORPORATION;NAGARAJAN, SIVAKUMAR;RAZDAN, SANDEEP;ANANTHAKRISHNAN, NISHA;WEINMAN, CRAIG, J.;MIRPURI, KABIRKUMAR, J. |
发明人 |
NAGARAJAN, SIVAKUMAR;RAZDAN, SANDEEP;ANANTHAKRISHNAN, NISHA;WEINMAN, CRAIG, J.;MIRPURI, KABIRKUMAR, J. |
