| 摘要 |
A packaging substrate includes a holder, a first conductive pad disposed on the holder, a core layer disposed on the holder, a circuit layer disposed on the core layer, a plurality of conductive vias disposed in the core layer, and an insulating protection layer disposed on the core layer, wherein the first electrical pad is embedded in the core layer. By combining the holder on one side of the packaging substrate, cracks due to over-thinness can be prevented during transferring or packaging. A method of fabricating the packaging substrate, a package structure having a holder, a method of fabricating the package structure are also provided.
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