| 摘要 |
The present invention relates to a method for regenerating a tantalum coil for sputtering that is disposed between a substrate and a sputtering target wherein the method for regenerating the tantalum coil for sputtering is characterized by a surface being removed (cutting until a re-deposition film or knurling processing remains are eliminated) by a process of cutting the entire or part of the coil surface of a tantalum coil that has been used, eliminating a re-deposition film formed during sputtering, and thereafter, applying new knurling to the locations that have been cut. The problem addressed by the present invention is: during sputtering, sputtering particles are deposited (re-deposition) on the surface of the tantalum coil, which is disposed between the substrate and sputtering target; however, when sputtering is completed, the sputtering particles that have been deposited on the coil that has been used are to be eliminated by cutting, and the tantalum coil can thus be regenerated efficiently; thus, technology that can provide elimination of unnecessary production of new coils, increase productivity, and stably provide these coils is provided. |
