发明名称 STACKABLE POWER SEMICONDUCTOR SWITCH USING SOLDERING AND BONDING TECHNIQUES
摘要 The invention relates to a circuit unit (15) for a converter with a power semiconductor switch (1), which has at least one collector connection (5), at least one emitter connection (4) as load connections and a control connection (6). In said unit, power semiconductor chips (8) arranged in a semiconductor housing (2) are connected to one another via bonding wires (12) for conducting load current. In order to provide said unit and to provide a current path between the load connections (4, 5), which current path can be controlled via the control connection (6), wherein the power semiconductor switch (1) is transferred from its on position, in which a current flow between the load connections (4, 5) in a forward direction is enabled, to its off position, in which a current flow between the load connections (4, 5) is interrupted, or vice versa, which circuit unit can be stacked so as to form a series circuit with identical power semiconductor switches, wherein the load connections are connected directly to one another without any further intermediate conductors, according to the invention, the collector connection(s) (4) and the emitter connection(s) (5) are arranged on opposite sides of the housing (2).
申请公布号 WO2013044966(A1) 申请公布日期 2013.04.04
申请号 WO2011EP67021 申请日期 2011.09.29
申请人 SIEMENS AKTIENGESELLSCHAFT;DORN, JOERG;HUANG, HARTMUT 发明人 DORN, JOERG;HUANG, HARTMUT
分类号 H02M7/00;H05K7/14 主分类号 H02M7/00
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