INTERLAYER COMMUNICATIONS FOR 3D INTEGRATED CIRCUIT STACK,申请号WO2011US54440-传众专利搜索

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发明名称	INTERLAYER COMMUNICATIONS FOR 3D INTEGRATED CIRCUIT STACK
摘要	<p>Some embodiments provide capacitive AC coupling inter-layer communications for 3D stacked modules.</p>
申请公布号	WO2013048501(A1)	申请公布日期	2013.04.04
申请号	WO2011US54440	申请日期	2011.09.30
申请人	INTEL CORPORATION;DROEGE, GUIDO;LINKEWITSCH, NIKLAS;SCHAEFER, ANDRE	发明人	DROEGE, GUIDO;LINKEWITSCH, NIKLAS;SCHAEFER, ANDRE
分类号	H01L27/00;H01L21/768	主分类号	H01L27/00
代理机构		代理人
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