发明名称 ACTIVATING-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVATING-LIGHT-SENSITIVE OR RADIATION-SENSITIVE FILM USING THE COMPOSITION, AND METHOD FOR FORMING PATTERNS
摘要 <P>PROBLEM TO BE SOLVED: To provide an activating-light-sensitive or radiation-sensitive resin composition capable of improving roughness performance and pattern collapse, an activating-light-sensitive or radiation-sensitive film using the composition, and a method for forming patterns. <P>SOLUTION: The composition includes a resin (A) effected by an acid to increase the solubility to an alkaline development liquid, and compounds (C) expressed by formulae (ZI-3), (ZI-4) and (ZI-5) that produce an acid due to irradiation of an activating light or radiation. The resin (A) includes at least one kind of repeating unit that has a group being decomposed due to acid. A group released by decomposition of the acid decomposable group has a ring structure, the ring structure has a polar group as a substituent, or the ring structure has a polar atom as a part of the ring structure, and the logP value of the compound derived from the release of the releasing group is equal to or larger than 0 and less than 2.8. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013061624(A) 申请公布日期 2013.04.04
申请号 JP20120075045 申请日期 2012.03.28
申请人 FUJIFILM CORP 发明人 IIZUKA YUSUKE;SHIBUYA AKINORI;TANGO NAOHIRO;KATAOKA SHOHEI
分类号 G03F7/004;C08F220/28;C08F220/38;G03F7/039;H01L21/027 主分类号 G03F7/004
代理机构 代理人
主权项
地址