| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor package which uses a substrate for a semiconductor package that improves underfill process in a flip chip package and ensures the reinforcement of a joining part (an electrode terminal), which enables a fillet to be formed into a preferable shape, inhibits the occurrence of peeling and cracks of a semiconductor element (a chip), and achieves high connection reliability. <P>SOLUTION: A manufacturing method of a semiconductor package includes a process where a semiconductor element is mounted on a surface of a wiring board through a flip chip mounting method and a gap between the wiring board and the semiconductor element is sealed with an underfill resin. The manufacturing method further includes a process where block like members for damming the underfill resin filling the gap are formed and disposed at portions of a surface of the wiring board which correspond to positions near four corners of the mounted semiconductor. The manufacturing method of the semiconductor package is adopted. <P>COPYRIGHT: (C)2013,JPO&INPIT |
