发明名称 TEMPERATURE SENSOR ATTACHMENT FACILITATING THERMAL CONDUCTIVITY TO A MEASUREMENT POINT AND INSULATION FROM A SURROUNDING ENVIRONMENT
摘要 A temperature sensor package includes a temperature sensor having a first side and a second side, wherein the first side of the temperature sensor includes an active region configured for coupling with a target area for temperature measurement of an object. The temperature sensor package further includes a circuit board having a first side and a second side, the first side of the circuit board coupled to the second side of the temperature sensor, wherein the circuit board provides thermal insulation between the active region of the temperature sensor and an environment on the second side of the circuit board.
申请公布号 US2013083326(A1) 申请公布日期 2013.04.04
申请号 US201113250478 申请日期 2011.09.30
申请人 CLARK MATTHEW;STARK TERRY DEAN;GOBLISH GEORGE;KOSHIOL MYLES;HONEYWELL INTERNATIONAL INC. 发明人 CLARK MATTHEW;STARK TERRY DEAN;GOBLISH GEORGE;KOSHIOL MYLES
分类号 G01C19/66;G01K7/22 主分类号 G01C19/66
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