发明名称 |
MICROELECTRONIC DEVICES HAVING INTERMEDIATE CONTACTS FOR CONNECTION TO INTERPOSER SUBSTRATES, AND ASSOCIATED METHODS OF PACKAGING MICROELECTRONIC DEVICES WITH INTERMEDIATE CONTACTS |
摘要 |
Microelectronic devices having intermediate contacts, and associated methods of packaging microelectronic devices with intermediate contacts, are disclosed herein. A packaged microelectronic device configured in accordance with one embodiment of the invention includes a microelectronic die attached to an interconnecting substrate. The microelectronic die includes an integrated circuit electrically coupled to a plurality of terminals. Each of the terminals is electrically coupled to a corresponding first contact on the die with an individual wire-bond. Each of the first contacts on the die is electrically coupled to a corresponding second contact on the interconnecting substrate by a conductive coupler such as a solder ball.
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申请公布号 |
US2013082384(A1) |
申请公布日期 |
2013.04.04 |
申请号 |
US201213686649 |
申请日期 |
2012.11.27 |
申请人 |
MICRON TECHNOLOGY, INC.;MICRON TECHNOLOGY, INC. |
发明人 |
FEE SETHO SING |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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