发明名称 EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
摘要 This epoxy resin composition contains: (A) an epoxy resin containing a compound indicated by general formula (I); (B) a phenol resin containing a compound indicated by general formula (II); and (C) a dihydroxynaphthalene compound containing a compound indicated by general formula (III). In formula (I), R indicates a hydrogen atom and n indicates an integer from 0 to 10. In formula (II), R1 indicates a hydrogen atom, an alkyl group having 1-6 carbon atoms, or an alkoxy group having 1-2 carbon atoms, and may be the same or different, and n indicates an integer from 0 to 1. In formula (III), R1 indicates a hydrogen atom, an alkyl group having 1-6 carbon atoms, or an alkoxy group having 1-2 carbon atoms.
申请公布号 WO2013047696(A1) 申请公布日期 2013.04.04
申请号 WO2012JP74960 申请日期 2012.09.27
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 OGIHARA, HIROKUNI;FURUSAWA, FUMIO;NAKAMURA, SHINYA;IKEUCHI, TAKATOSHI;YAMAMOTO, TAKASHI
分类号 C08G59/32;C08G59/62;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/32
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