发明名称 |
STUB MINIMIZATION FOR ASSEMBLIES WITHOUT WIREBONDS TO PACKAGE SUBSTRATE |
摘要 |
A microelectronic package can include a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and centered relative to the columns of element contacts. Columns of package terminals can extend in the first direction. First terminals in a central region of the second surface can be configured to carry address information usable to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between the columns of package terminals. The axial plane can intersect the central region. |
申请公布号 |
US2013083582(A1) |
申请公布日期 |
2013.04.04 |
申请号 |
US201213439286 |
申请日期 |
2012.04.04 |
申请人 |
CRISP RICHARD DEWITT;ZOHNI WAEL;HABA BELGACEM;LAMBRECHT FRANK;INVENSAS CORPORATION |
发明人 |
CRISP RICHARD DEWITT;ZOHNI WAEL;HABA BELGACEM;LAMBRECHT FRANK |
分类号 |
G11C5/06 |
主分类号 |
G11C5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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