发明名称 Thermoelectric devices
摘要 1,113,005. Thermoelectric devices. WESTINGHOUSE ELECTRIC CORPORATION. 27 July, 1966 [9 Aug., 1965], No. 33711/66. Heading H1K. [Also in Division B3] A self-spacing solder which has insoluble metallic particles dispersed through a soft solder component, the particles being of selected size in order to maintain the required spacing of surfaces to be soldered together is used to bond a thermoelectric body to one or more metallic contacts. The solder compositions are as given in Specification 1,112,693. Thin discs 28, 40, and 46, of the solder are employed to bond a thermoelectric pellet 22 to metallic contacts 18, 30 and to bond the contact 30 to the end of a braided copper lead 42. The pellet 22 may be of P-type germanium bismuth telluride or N-type lead telluride; germanium telluride, zinc antimonide and other metallic sulfides, selenides, antimonides and tellurides may similarly be bonded. The contacts may be of iron, cobalt, nickel, nickel alloy, copper or stainless steel. Tin-coated iron contacts are referred to. The solder may similarly be used to bond two components to form a thermoelectric couple (Fig. 2, not shown). Soldering is effected by placing the assembled devices in an oven or furnace and heating to a temperature within the range 235‹ C.-425‹ C. with a stream of hydrogen passing through the furnace. In Example 3 reference is made by way of comparison to two similar thermoelectric couples, one having hard solder joints the solder comprising an alloy of gold and zinc and the other having a nickel phosphide diffusion bonded joint. In Examples 4 and 5 the solder used is pure lead with iron particles and no phosphorus is included.
申请公布号 GB1113005(A) 申请公布日期 1968.05.08
申请号 GB19660033711 申请日期 1966.07.27
申请人 WESTINGHOUSE ELECTRIC CORPORATION 发明人
分类号 H01L35/08 主分类号 H01L35/08
代理机构 代理人
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