METHOD FOR MANUFACTURING OF PRINTED CIRCUIT BOARD

摘要

PURPOSE: A manufacturing method of a PCB(Printed Circuit Board) is provided to implement a fine pitch circuit pattern by obtaining the width of a wire bonding pad. CONSTITUTION: A plating layer(110) is formed on a base board(100). The exposed plating layer is eliminated through a part in which the pattern of an etching resistance(120) is formed. The etching resistance covers the plating layer forming a metal layer(130) with vacuum pressing. The etching resistance is eliminated by forming a circuit pattern on the metal layer or the plating layer.