发明名称 APPARATUS FOR MANUFACTURING FLEXIBLE PRINTED WIRING BOARD, APPARATUS FOR MANUFACTURING WIRING BOARD, AND APPLYING DEVICE
摘要 According to one embodiment, an apparatus includes: a device configured to partially provide a second conductor layer on a surface of a first conductor layer; a device configured to partially provide a first insulating layer on the surface of the first conductor layer; a device configured to integrate the first conductor layer, the second conductor layer, the first insulating layer, and a third conductor layer, in a state in which the second conductor layer and the first insulating layer provided on the surface of the first conductor layer are covered with the third conductor layer from a side opposite the first conductor layer; a device configured to form a conductor pattern by partially removing at least one of the first conductor layer and the third conductor layer in a structure obtained by the integrating; and a device configured to cover both sides of the structure.
申请公布号 US2013081568(A1) 申请公布日期 2013.04.04
申请号 US201213463580 申请日期 2012.05.03
申请人 HAPPOYA AKIHIKO;TORIGOSHI YASUKI;TAMAI SADAHIRO 发明人 HAPPOYA AKIHIKO;TORIGOSHI YASUKI;TAMAI SADAHIRO
分类号 B05C5/02;B05C11/00;B05C13/02 主分类号 B05C5/02
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