发明名称 Extended Drain Lateral DMOS Transistor with Reduced Gate Charge and Self-Aligned Extended Drain
摘要 A method to form a LDMOS transistor includes forming a gate/source/body opening and a drain opening in a field oxide on a substrate structure, forming a gate oxide in the gate/source/body opening, and forming a polysilicon layer over the substrate structure. The polysilicon layer is anisotropically etched to form polysilicon spacer gates separated by a space in the gate/source/body opening and a polysilicon drain contact in the drain opening. A body region is formed self-aligned about outer edges of the polysilicon spacer gates, a source region is formed self-aligned about inner edges of the polysilicon spacer gates, and a drain region is formed under the polysilicon drain contact and self-aligned with respect to the polysilicon spacer gates. A drift region forms in the substrate structure between the body region and the drain region, and a channel region forms in the body region between the source region and the drift region.
申请公布号 US2013082335(A1) 申请公布日期 2013.04.04
申请号 US201113250995 申请日期 2011.09.30
申请人 ZINN DAVID R.;MICREL, INC. 发明人 ZINN DAVID R.
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
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