ELECTROSTATIC CHUCK DEVICE

摘要

Provided is an electrostatic chuck device whereby the temperature distribution on the placement surface on which a plate-like sample such as a wafer is placed can be made uniform and the plasma density on the plate-like sample can be made uniform to improve the surface uniformity in plasma etching of the plate-like sample. Such an electrostatic chuck device comprises an electrostatic chuck section that has an upper surface as a placement surface for placing a plate-like sample and incorporates an electrostatic adsorbing internal electrode, and a cooling base section for cooling the electrostatic chuck section. A heater element (4) having a heater pattern (21) with a prescribed shape is provided between the electrostatic chuck section and the cooling base section. An island-like portion (24) that is independent from the heater pattern (21) and is made of the same material as the heater pattern (21) is provided in a gap (23) in the heater pattern (21).