| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an insulating film excellent in heat resistance and discharge degradation resistance, and with a long insulation lifetime. <P>SOLUTION: This insulating film includes a heat-resistant resin and insulating microparticles dispersed in the heat-resistant resin, where the average diameter of inscribed circle in regions not containing the insulating microparticle is 80-900 nm. <P>COPYRIGHT: (C)2013,JPO&INPIT |
