JOINING APPARATUS, JOINING METHOD, JOINING SYSTEM, PROGRAM, AND COMPUTER STORAGE MEDIUM

摘要

PROBLEM TO BE SOLVED: To make thicknesses of two substrates uniform after joining when the two substrates are joined through an adhesive by pressing.

SOLUTION: A support wafer S held by a second holding part 201 is pressed against a processed wafer W held by a first holding part 200 and to which an adhesive G is applied by using a pressing member 251. The pressing member 251 has multiple pressing mechanisms 252. A pressing part 252b of each pressing mechanism 252 is operated by rotations of a motor M through a ball screw mechanism. The pressing degree of the pressing part 252b is independently controlled by controlling the motor M. Thus, the pressing force of the pressing parts 252b of the respective pressing mechanism 252 is equalized by obtaining a revolution counter of the motor M that the thickness of the wafer after joining becomes a predetermined thickness. This structure enables the thicknesses of the wafers after joining to be uniform.

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