| 摘要 |
An apparatus for receiving a mold assembly having a first mold portion and a second mold portion operably connected with one another for forming parts. The apparatus includes a mold holding member and a pair of support members spaced from one another and extending from the mold holding member to a manufacturing floor. A carriage device is cooperable with the mold holding member for engaging and moving the mold assembly. A lifting mechanism of the apparatus is used for moving the carriage device relative the mold holding member to move the mold assembly to be engaged with mold holding member. The lifting mechanism and the carriage device apply forces to opposite surfaces of the mold holding member to prevent the mold holding member from deflection and distortion to eliminate offset between the first mold portion and the second mold portion thereby eliminating defective parts as said apparatus forms the parts.
|
