发明名称 CERAMIC ELECTRONIC COMPONENT
摘要 In a ceramic electronic component having a thin structure, particularly, the occurrence of cracks is prevented which are possibly caused due to stress applied when the ceramic component is mounted or in a mounted state. Each of first and second external terminal electrodes (23 and 24) has a substantially rectangular region on a principal surface of a ceramic element body, the principal surface being directed to the mounting surface side. An end of the first external terminal electrode, which is positioned in contact with a gap region (34), and each ends of the second external terminal electrodes (37,38), which are positioned in contact with the gap region, are each formed in a concave-convex shape on the principal surface.
申请公布号 KR101251022(B1) 申请公布日期 2013.04.03
申请号 KR20090107562 申请日期 2009.11.09
申请人 发明人
分类号 H01B3/12;H01G4/12 主分类号 H01B3/12
代理机构 代理人
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