| 摘要 |
Disclosed is a photosensitive resin composition that has a high film remaining rate after curing in the formation of a cyclized resin and has high-sensitivity, positive-working lithography properties. Also disclosed are a process for producing a cured relief pattern using the photosensitive resin composition and a semiconductor device comprising the cured relief pattern. The photosensitive resin composition comprises (A) 100 parts by mass of a polymer, which has a specific precursor structure and is soluble in an aqueous alkali solution, (B) 1 to 50 parts by mass of a photoacid generating agent, and (C) 5 to 20 parts by mass of a monocarboxylic acid compound having 8 or more carbon atoms and containing at least one functional group selected from the group consisting of hydroxyl, ether, and ester groups at the a-position of the carboxyl group. |
