PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A package substrate and a manufacturing method thereof are provided to reduce the manufacturing costs and time by removing a copper plating process on the upper and lower sides of a base substrate and the inner side of a via hole. CONSTITUTION: A circuit pattern(110) is formed on the upper side of a base substrate(100). The base substrate is composed of a copper laminate plate. A plurality of via holes(121) are formed on the base substrate for interlayer conduction. The via is formed by filling the inner side of the via hole with conductive paste without a copper plating process. A solder bump(200) surrounds a protrusive part(122) of the via. A solder resist layer(130) is formed on the upper and lower sides of the base substrate to protect the circuit pattern.