发明名称 |
BUILT-IN ANTENNA MODULE FOR MOBILE DEVICE AND MANUFACTURING METHOD OF THE SAME |
摘要 |
<p>PURPOSE: A built-in antenna module for a mobile communication device and a manufacturing method thereof are provided to serve as a matching circuit for impedance matching and to miniaturize the size of the antenna module. CONSTITUTION: A built-in antenna module comprises a non-conductive synthetic resin carrier(110), a radiation pattern(120), a radiating pattern(125), a plating prevention film(130), and a SMD(Surface-Mounted Device)(150). The non-conductive synthetic resin carrier forms a female pattern on the outer surface. The radiation pattern is formed by injecting a plating resin material to the female pattern. The radiation pattern is placed by conductive substrate to form the radiating pattern. The plating prevention film forms non-continuous parts by crossing between lines of the radiation pattern. The SMD is positioned on the plating prevention pattern.</p> |
申请公布号 |
KR20130033091(A) |
申请公布日期 |
2013.04.03 |
申请号 |
KR20110096954 |
申请日期 |
2011.09.26 |
申请人 |
ETHERTRONICS KOREA CO., LTD. |
发明人 |
LAURENT PIERREEUGENE DESCLOS;JEONG, SEONG GI;CHOI, SEUNG WOONG;SEOL, CHEOL HUN;LEE, WON SUL |
分类号 |
H01Q1/24;H01Q13/08 |
主分类号 |
H01Q1/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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