| 摘要 |
PURPOSE: A QFN(Guad Flat No-leads) package and a manufacturing method are provided to minimize the volume of the package by not using a die paddle. CONSTITUTION: A lead frame includes a ground ring(110) and a plurality of external connectors(120). A bonding wire(20) electrically connects a semiconductor chip(10) and the lead frame. The bonding wire includes a first bonding wire(22) and a second bonding wire(24). The first bonding wire and the second bonding wire are connected to a first side(12) of the semiconductor chip. An encapsulating material(300) surrounds the semiconductor chip and the bonding wire. |
