发明名称 |
BUILT IN ANTENNA MODULE MANUFACTURE METHOD AND THAT'S GOODS |
摘要 |
PURPOSE: A method for manufacturing an embedded antenna module and the embedded antenna module manufactured by the same are provided to actively deal with various mobile devices by directly processing a pattern of the embedded antenna on a base surface. CONSTITUTION: A base surface is plated with electroless copper(S70). The outside of a pattern except an antenna pattern is etched with a laser on the electroless copper plated base surface(S80). When the pattern is obtained, a pattern region is electroplated(S90). An electroless copper plated part is corroded in a region except the pattern(S100). The remaining pattern region after corrosion is electrically plated with nickel(S110). [Reference numerals] (S10) Plasma surface processing step; (S100) Pattern except area corrosion step; (S110) Electrical nickel plating step; (S20) Conductive polymer coating step; (S30) Etching step; (S40) Neutralization step; (S50) Catalytic step; (S60) Active step; (S70) Electroless copper plating step; (S80) Laser etching step; (S90) Pattern area electrolytic copper plating step; |
申请公布号 |
KR101250644(B1) |
申请公布日期 |
2013.04.03 |
申请号 |
KR20110137955 |
申请日期 |
2011.12.20 |
申请人 |
OH, SANG JIN;JEONG, SU GIL |
发明人 |
JEONG, SU GIL |
分类号 |
H01Q1/24;H01Q9/04;H01Q13/08 |
主分类号 |
H01Q1/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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