| 摘要 |
<p>PURPOSE: A radiation sensitive resin composition, a resist pattern forming method using the same, and an acid generator used in the same are provided to be able to apply a resist pattern forming method in the dipping exposure process, and to be able to form more minute resist patterns. CONSTITUTION: The radiation sensitive resin composition contains an acid generator which generates the compound represented by chemical formula 1 by radiation irradiation. In the chemical formula 1, R1 is a monovalence organic group with 1-20 carbons. R2 is hydrogen or a monovalence organic group with 1-20 carbons. A resist pattern forming method comprises the following steps: a step of forming a resist film on the substrate using the photo sensitive resin composition; a step of exposing the formed resist film; and a step of developing the exposed resist film.</p> |
