METHOD OF LAMINATING SUBSTRATES

摘要

PURPOSE: A method for laminating substrates is provided to prevent strength degradation in small substrates by strengthening the small substrates before one-off lamination. CONSTITUTION: The one-off lamination of small substrates and a large substrate is performed(S1). The small substrates are strengthened before one-off lamination. The small substrates are located by providing negative pressure adsorbing the small substrates through a first platform(S2). The small substrates are located on the first platform by para-positioning with a CCD(Charged-Coupled Device)(S3). [Reference numerals] (110) Small substrates; (120) Large substrates; (AA) Locating of the small substrates; (BB) Locating of the large substrates; (S1) Obtaining a material; (S2) Locating; (S3) Mutual para-positioning; (S4) One-off lamination;