SOCKET FOR TESTING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package testing socket capable of indirectly contacting a contactor is provided to minimize the damage of the exterior and the loss of a restoring force in a connection structure by indirectly performing the contact of a cushion unit of the connection structure to a contact ball. CONSTITUTION: A semiconductor package testing socket includes a contact structure(1) and a connection structure(3). The contact structure includes a bump plate(11) on which multiple first holes penetrated from the top to the bottom are formed, and the contact structure and the connection structure are connected by being adhered to a connection plate which includes multiple contactors(13) respectively mounted on the first holes. The connection structure includes a connection plate(31) on which multiple second holes penetrated from the top to the bottom are formed and includes multiple cushion units(33) placed at positions corresponding to the contractors by being respectively mounted on the second holes.