| 摘要 |
PURPOSE: A laser processing method is provided to form reforming regions by focusing laser beams inside a substrate along a cutting intended line in a curved shape formed in the boundary of the substrate, and to prevent changes in optical properties possible to be generated in an edge portion of the substrate. CONSTITUTION: A laser processing method comprises the following steps: a step of forming a plurality of first reforming regions between a first surface(110b) of a substrate(110) and the inside of the substrate, by focusing first laser beams along a cutting intended line in a curved shape which is formed in the boundary of the substrate; and a step of separating an edge portion(110e) of the substrate by cracks generated by the first reforming regions. |
