Clip for semiconductor package, semiconductor package using the same amd method for fabricating the package

摘要

PURPOSE: A clip for a semiconductor package, the semiconductor package using the same, and a fabricating method for the semiconductor package are provided to increase working speed by reducing on-resistance by connecting both a source and a gate of a semiconductor die to a lead frame. CONSTITUTION: A source gate integrated clip(30) comprises a source clip part(31), a gate clip part(32), and a connection part(33). The source clip part electrically connects a source area of a semiconductor die and a source lead of a lead frame. The gate clip part electrically connects a gate region of the semiconductor die and a gate lead of the lead frame. The connection part connects the source clip part and the gate clip part. The source clip part, the source clip part, and the gate clip part are made of the same material.