PRINTED CIRCUIT BOARD AND A MANUFACTURING METHOD FOR THE SAME

摘要

PURPOSE: A PCB(Printed Circuit Board) including a metal post and a PCB manufacturing method are provided to increase reliability for connection with a semiconductor chip by obtaining a combination area with a solder ball. CONSTITUTION: A pad is formed on a substrate(110). A conductive post(114) is formed on the pad. A first solder resistance layer(120) exposes the conductive post which is formed at a lower height than the conductive post of the substrate. A second solder resistance layer(140) exposes the conductive post by forming a passing through hole of a large diameter. A surface processing layer(150) is formed at the conductive post.