SEMICONDUCTOR CHIP TESTING METHOD AND SEMICONDUCTOR CHIP TESTING DEVICE

摘要

PURPOSE: A semiconductor chip testing method and a semiconductor chip testing apparatus are provided to determine only the semiconductor chip with high reliability by including a determination updating unit, a failure rate calculating unit, and a determination unit. CONSTITUTION: A determination unit(1) determines an electrical property of each chip on a wafer. A cassette receiving unit(2) receives a semiconductor wafer group which is determined by the determination unit in a cassette. A marking unit(3) marks information to display a failure of a chip. A failure rate calculating unit(4) calculates a failure rate. A failure rate determining unit(5) outputs the failure rate determination result to a determination updating unit(6) and an alarm unit(7). The alarm unit transmits an alarm to the outside if the failure rate of a wafer address is a critical value or more. [Reference numerals] (1) Determination unit; (2) Cassette receiving unit; (3) Marking unit; (4) Failure rate calculating unit; (5) Failure rate determining unit; (6) Determination updating unit; (7) Alarm unit;