发明名称 |
Electronic device package, module, and electronic device |
摘要 |
The present invention is directed to provide a semiconductor package and the like realizing reduced manufacturing cost and improved reliability by enhancing a ground line and/or a power supply line. A semiconductor package 50 includes: a semiconductor device 1 including a circuit face on which an external electrode is formed; an insertion substrate 2 forming a housing part in which the semiconductor device 1 is disposed; and an interposer substrate 5 including a wiring pattern 7 and whose both ends are bent along the insertion substrate 2. The insertion substrate 2 is made of a conductive material and is electrically connected to a ground line or a power supply line in the wiring pattern 7 in the interposer substrate 5.
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申请公布号 |
US8411450(B2) |
申请公布日期 |
2013.04.02 |
申请号 |
US20070161825 |
申请日期 |
2007.01.25 |
申请人 |
YAMAZAKI TAKAO;SOGAWA YOSHIMICHI;NISHIYAMA TOMOHIRO;NEC CORPORATION |
发明人 |
YAMAZAKI TAKAO;SOGAWA YOSHIMICHI;NISHIYAMA TOMOHIRO |
分类号 |
H05K1/00;H01L23/02;H01L23/34;H05K1/03;H05K1/14;H05K7/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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