| 摘要 |
<p>PURPOSE: A method for forming structured-open-network polishing pads is provided to prevent the generation of scratches by improving a wafer scratching process. CONSTITUTION: A polymer is removed from a developing unit(16). A water spraying unit(18) removes an ultrasonic bath and a water-soluble polymer. A long channel passes through the thickness of a sheet or a film(12). The sheet or the film moves to a collecting roll(30), and passes through a dryer(20) for removing the excess of a solvent.</p> |
