| 摘要 |
An LED package comprises a substrate, a constant current die, an LED die and an encapsulation body. The substrate has a plurality of internal conductive contacts and a plurality of external conductive contacts. The constant current die is electrically connected to the internal conductive contact, and comprises a constant current circuit and a protection circuit in parallel, wherein the constant current circuit allows a first current to flow through and the protection circuit allows a second current, in an opposite direction to the first current, to flow through. The LED die is electrically connected to the internal conductive contact. The encapsulation body encapsulates the constant current die, the LED die and the internal conductive contacts of the substrate. Having a small volume, the LED package can be applied to a compact lamp and prevents the LED from being damaged. An LED lamp comprising the LED package is also disclosed. |
