发明名称 |
Electronic device submounts with thermally conductive vias and light emitting devices including the same |
摘要 |
A submount for an electronic device includes an electrically insulating substrate including first and second surfaces and having a thickness between the first and second surfaces, a thermally conductive pad on the first surface of the substrate, and a thermally conductive via extending from the first surface of the substrate toward the second surface of the substrate and having a length that is less than the thickness of the substrate. The thermally conductive via has a higher thermal conductivity than a thermal conductivity of the substrate. Methods of forming submounts are also disclosed.
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申请公布号 |
US8410371(B2) |
申请公布日期 |
2013.04.02 |
申请号 |
US20090555218 |
申请日期 |
2009.09.08 |
申请人 |
ANDREWS PETER S.;LOWES THEODORE D.;UNDERWOOD ROBERT D.;CREE, INC. |
发明人 |
ANDREWS PETER S.;LOWES THEODORE D.;UNDERWOOD ROBERT D. |
分类号 |
H05K7/20;H05K1/16 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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