发明名称 |
Integrated circuit packaging system with underfill and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a substrate with a projection formed along a perimeter of a first surface of the substrate; mounting an integrated circuit over the first surface; forming a protruding interconnect over the first surface between the projection and the integrated circuit; and forming an underfill between the integrated circuit and the projection with a uniform height, the uniform height of the underfill less than a height of the projection. |
申请公布号 |
US8409923(B2) |
申请公布日期 |
2013.04.02 |
申请号 |
US201113161368 |
申请日期 |
2011.06.15 |
申请人 |
KIM OH HAN;KANG YONG HEE;CHOI DAESIK;STATS CHIPPAC LTD. |
发明人 |
KIM OH HAN;KANG YONG HEE;CHOI DAESIK |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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