发明名称 |
Thermal interface material application for integrated circuit cooling |
摘要 |
Techniques provide improved thermal interface material application in an assembly associated with an integrated circuit package. For example, an apparatus comprises an integrated circuit module, a printed circuit board, and a heat transfer device. The integrated circuit module is mounted on a first surface of the printed circuit board. The printed circuit board has at least one thermal interface material application via formed therein in alignment with the integrated circuit module. The heat transfer device is mounted on a second surface of the printed circuit board and is thermally coupled to the integrated circuit module. The second surface of the printed circuit board is opposite to the first surface of the printed circuit board.
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申请公布号 |
US8411444(B2) |
申请公布日期 |
2013.04.02 |
申请号 |
US20100882362 |
申请日期 |
2010.09.15 |
申请人 |
GAYNES MICHAEL ANTHONY;KAM DONG GUN;LIU DUIXIAN;REYNOLDS SCOTT KEVIN;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GAYNES MICHAEL ANTHONY;KAM DONG GUN;LIU DUIXIAN;REYNOLDS SCOTT KEVIN |
分类号 |
H05K7/20;H05K9/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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