发明名称 EMBEDDED RF VERTICAL INTERCONNECT FOR FLEXIBLE CONFORMAL ANTENNA
摘要 A method of making an RF signal transition in a printed wiring board structure including a plurality of printed wiring board layers forming a multi-layer flexible laminate, comprises, forming a plurality of interconnected buried vias by precutting via holds in an adhesive layer intervening each printed wiring board prior to the lamination process and, filling the precut via holes in the adhesive layer with a conducting material that will set during the laminating process; precutting via holes in each of the respective printed wiring board layers and filing the precut via holes in each respective printed wiring board layer with a conducting material that will set during the laminating process; forming on each side of the respective printed wiring boards catch pads surrounding the respective via holes; and aligning the via holes in the adhesive layers with respective catch pad on at least one side of the respective adhesive layer.
申请公布号 CA2729740(C) 申请公布日期 2013.04.02
申请号 CA20042729740 申请日期 2004.07.22
申请人 RAYTHEON COMPANY 发明人 KERNER, STEPHEN R.;QUAN, CLIFTON;ROKOSKY, RAQUEL Z.
分类号 H01Q1/38;H01P5/08;H01P11/00;H01Q1/40;H01Q21/00;H01Q23/00;H05K1/00;H05K1/02;H05K1/16;H05K1/18;H05K3/46 主分类号 H01Q1/38
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