发明名称 |
Semiconductor device with chip mounted on a substrate |
摘要 |
A semiconductor device is disclosed. At least one semiconductor chip is mounted on a substrate and is contacted to contact elements of the substrate. The encapsulation of the semiconductor chip includes the substrate, a cover and a pocket within the connected substrate and cover. The pocket is able to fix the chip in its position, and the cover is composed of the same material as the substrate.
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申请公布号 |
US8410595(B2) |
申请公布日期 |
2013.04.02 |
申请号 |
US20070966960 |
申请日期 |
2007.12.28 |
申请人 |
KROEHNERT STEFFEN;NOCKE KERSTIN;GRAFE JUERGEN;MACHANI KASHI VISHWANATH;QIMONDA AG |
发明人 |
KROEHNERT STEFFEN;NOCKE KERSTIN;GRAFE JUERGEN;MACHANI KASHI VISHWANATH |
分类号 |
H01L23/055 |
主分类号 |
H01L23/055 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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