SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

摘要

PURPOSE: A semiconductor package and a method for forming the same are provided to secure high density integration by covering a protruding through via with a wetting layer. CONSTITUTION: A through via(19a) passes through a substrate(1). A wetting layer(13a) is formed between the through via and the substrate. A seed layer(17a) is formed between the wetting layer and the through via. The through via protrudes on the surface of the substrate. The width of the through via is the same as or larger than the height of the protruding through via.