发明名称 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 <p>PURPOSE: A PCB(Printed Circuit Board) and a manufacturing method thereof are provided to simultaneously satisfy high functionalization and to reduce the thickness of the PCB. CONSTITUTION: A PCB(100) comprises an insulation layer(110), a circuit pattern(120), and a cavity(140) for inserting a semiconductor chip. The insulation layer includes a first insulation material and a second insulation material formed on the first insulation material. The circuit pattern is formed at an outer layer and an inner layer of the insulation layer. The cavity for inserting the semiconductor chip is formed at the first or the second insulation material.</p>
申请公布号 KR20130032529(A) 申请公布日期 2013.04.02
申请号 KR20110096174 申请日期 2011.09.23
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 YOON, KYOUNG RO;CHO, SOON JIN
分类号 H05K3/46;H05K1/18 主分类号 H05K3/46
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