发明名称 HOUSING FOR ELECTRONIC EQUIPMENT UNIT
摘要 A housing for an electronic device unit includes a first case and a second case that are formed in a shape of a box with one of respective surfaces thereof being opened and are formed to be a box body. The housing includes an insulating plate that extends from the opening part of the first case to a side of the second case and overlaps with a wall surface of the second case. An engaging convex part is formed on a surface where the insulating plate is overlapped and an engaging hole that engages with the engaging convex part to regulate separation of the first case and the second case is formed. The insulating plate is in a shape in which an edge of the insulating plate spreads with a predetermined width from an opening edge where the first case and the second case are butted and the engaging hole.
申请公布号 KR20130032909(A) 申请公布日期 2013.04.02
申请号 KR20137004249 申请日期 2010.07.30
申请人 MITSUBISHI ELECTRIC CORPORATION 发明人 MIYAZAKI TAKAYUKI;NOMOTO HIROKAZU
分类号 H05K5/02 主分类号 H05K5/02
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