发明名称 |
Lead frame, resin package, semiconductor device and resin package manufacturing method |
摘要 |
A pressure loss section H1 (H2) extends from a position corresponding to a corner of a resin package, and S1 is the minimum value of the opening area of the pressure loss section H1 (H2) perpendicular to the direction of resin flow (X axis) in the pressure loss section H1 (H2) during resin molding, while S2 is the average value of the opening areas of excess resin reservoirs H3 to H5 perpendicular to the direction of resin flow (Y axis) within excess resin reservoir H3 to H5 during molding. In this lead frame, S1<S2 is satisfied.
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申请公布号 |
US8410589(B2) |
申请公布日期 |
2013.04.02 |
申请号 |
US20090545176 |
申请日期 |
2009.08.21 |
申请人 |
MATSUMI YASUO;MAEDA MITSUO;SUMITOMO CHEMICAL COMPANY, LIMITED |
发明人 |
MATSUMI YASUO;MAEDA MITSUO |
分类号 |
H01L23/495;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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