发明名称 PLASMA ETCHING CHAMBER
摘要 A plasma etching chamber is provided to replace an upper electrode without disassembling a stem by installing the upper electrode by a fixing bolt inserted into the lower part of the stem. The edge of a wafer is etched by plasma in a plasma etching chamber. An insulation panel(14) controls formation of plasma, positioned in the center of the wafer. A panel ring(22) is detachably installed on the edge of the insulation panel. The surface of the panel ring can be coated with yttrium. A coating panel(20) coated with yttrium can be installed under the insulation panel.
申请公布号 KR101249247(B1) 申请公布日期 2013.04.01
申请号 KR20060131798 申请日期 2006.12.21
申请人 发明人
分类号 H01L21/3065 主分类号 H01L21/3065
代理机构 代理人
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