发明名称 |
THERMALLY CONDUCTIVE POLYESTER MOLDING MATERIALS |
摘要 |
THERMOPLASTIC MOLDING MATERIALS COMPRISING A) FROM 10 TO 69% BY WEIGHT OF A THERMOPLASTIC POLYESTER, B) FROM 30 TO 79% BY WEIGHT OF AN ALUMINUM OXIDE, C) FROM 0.01 TO 10% BY WEIGHT OF ALL ORGANIC OR INORGANIC ACID OR MIXTURES THEREOF, D) FROM 0 TO 10% BY WEIGHT OF D1) AT LEAST ONE HIGHLY BRANCHED OR HYPERBRANCHED POLYCARBONATE HAVING AN OH NUMBER OF FROM 1 TO 600 MG KOH/G OF POLYCARBONATE (TO DIN 53240. PART 2) OR D2) AT LEAST ONE HIGHLY BRANCHED OR HYPERBRANCHED POLYESTER OF THE AXBY TYPE WHERE X IS AT LEAST 1.1 AND Y IS AT LEAST 2.1 OR MIXTURES THEREOF, E) FROM 0 TO 50% BY WEIGHT OF FURTHER ADDITIVES. WHERE THE SUM OF THE PERCENTAGES BY WEIGHT OF COMPONENTS A) TO E) ADDS UP TO 100%. |
申请公布号 |
MY148352(A) |
申请公布日期 |
2013.03.29 |
申请号 |
MY2009PI01458 |
申请日期 |
2007.10.02 |
申请人 |
BASF SE |
发明人 |
FUKUHARA, HIROKI;EIPPER, ANDREAS;WEIS, CARSTEN;VOELKEL, MARK;STRANSKY, REINHARD;ASMANN, JENS;WEBER, MARTIN |
分类号 |
C08K3/22 |
主分类号 |
C08K3/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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