| 摘要 |
PURPOSE: A positive photosensitive resin composition, a photosensitive resin film formed using the same, and a semiconductor device containing the photosensitive resin film are provided to maximize an effect of suppressing a non-exposure portion and to minimize film thickness reduction. CONSTITUTION: A positive photosensitive resin composition comprises a repeat unit of chemical formula 1 or a repeat unit of chemical formulas 1 and 2. The composition contains a polyvenzoxazole precursor having a thermal polymerization functional group in at least one end; a dissolution adjuster in which phenolic hydroxyl group of polyvalent phenolic compound is partially or entirely substituted with a degradable functional group; an acid generator; silane compounds; and a solvent. |
