发明名称 |
METHOD AND DEVICE FOR THERMALLY COUPLING A HEAT SINK TO A COMPONENT |
摘要 |
A heat sink is thermally coupled to a component with a thermal filler and an intermediate layer applied between the heat sink and the component. The intermediate layer is formed with apertures and the heat sink is pressed against the component with a given force in order for the thermal filler to penetrate the apertures of the intermediate layer. |
申请公布号 |
KR20130031851(A) |
申请公布日期 |
2013.03.29 |
申请号 |
KR20127033477 |
申请日期 |
2010.05.21 |
申请人 |
NOKIA SIEMENS NETWORKS OY |
发明人 |
VOSS STEFAN;SIEBERT ANDREAS |
分类号 |
H01L23/373;H01L23/42 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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