| 摘要 |
The present invention relates to a socket device for an integrated circuit (IC) test, the device comprising: a socket provided with a pin guide plate that can guide and protect a spring contact so as to prevent damage to or breakage of the spring contact that electrically connects an IC lead and a PCB; and an IC insert provided with a guide plate. According to said configuration, ball grid array (BGA)-type ICs in which IC leads that are test subjects have balls that can be more efficiently tested. In particular, contact pins of the socket and the IC leads are mechanically and electrically more precisely positioned for narrow pitches of the IC leads such as 0.4 mm, 0.35 mm, and 0.3 mm, thereby minimizing damage to or breakage of the ICs being tested and minimizing damage to or breakage of the socket. |
